QiQun Zhang

Title: Innovations of QiQun Zhang in Integrated Circuit Fabrication

Introduction

QiQun Zhang is a notable inventor based in Santa Clara, CA, who has made significant contributions to the field of integrated circuit fabrication. With a focus on improving the manufacturing processes of dual damascene features, his work has implications for enhancing device yield and performance.

Latest Patents

QiQun Zhang holds a patent for a method titled "BARC shaping for improved fabrication of dual damascene integrated circuit features." This invention addresses the challenges associated with the via-first dual damascene fabrication process. The patent describes a method for depositing a bottom-antireflective-coating (BARC) into the via and surrounding field regions. The invention aims to eliminate the formation of fencing material at the bottom of the via, which can hinder conformal coating and reduce device yield. By forming a BARC plug with a convex upper surface prior to trench etching, the invention facilitates a cleaner dual damascene structure for subsequent coating. A directional, anisotropic etching method, particularly using ammonia plasma, is suggested for effectively removing BARC and achieving the desired surface shape.

Career Highlights

QiQun Zhang is currently employed at Applied Materials, Inc., a leading company in the semiconductor manufacturing equipment industry. His work at Applied Materials has allowed him to apply his innovative ideas to real-world applications, contributing to advancements in integrated circuit technology.

Collaborations

Throughout his career, QiQun Zhang has collaborated with esteemed colleagues such as Chang-Lin Hsieh and Jie Yuan. These collaborations have fostered a productive environment for innovation and have led to significant advancements in their respective fields.

Conclusion

QiQun Zhang's contributions to the field of integrated circuit fabrication, particularly through his patented methods, highlight his role as an influential inventor. His work continues to impact the semiconductor industry positively, paving the way for improved manufacturing processes and device performance.