Hangzhou, China

Qingyu Li

This inventor holds 1 USPTO granted patent. Top assignee: Zhejiang University. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Qingyu Li. Retrieved from https://idiyas.com/inventor/qingyu-li-s6mri6ln

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Innovations in 3D Printing by Qingyu Li

Introduction

Qingyu Li is an innovative inventor based in Hangzhou, China. He has made significant contributions to the field of 3D printing, showcasing his expertise through his patented methods. His work is particularly relevant in today's rapidly evolving technological landscape.

Latest Patents

Qingyu Li holds a patent for a novel 3D printing method. This method involves several steps, including importing a model into the printing area, utilizing a support unit arranged in an array, and traversing supporting divisions to determine the lowest points on the model. The process includes hierarchically slicing the model to create 2D contour lines and controlling the printer's operation to ensure precise printing of the physical model. This innovative approach enhances the efficiency and accuracy of 3D printing.

Career Highlights

Qingyu Li is affiliated with Zhejiang University, where he continues to advance his research and development in 3D printing technologies. His work has garnered attention for its potential applications in various industries, including manufacturing and design.

Collaborations

Qingyu Li collaborates with notable colleagues such as Hongyao Shen and Xiaoxiang Ye. Their combined expertise contributes to the advancement of innovative solutions in the field of 3D printing.

Conclusion

Qingyu Li's contributions to 3D printing exemplify the importance of innovation in technology. His patented methods not only enhance the printing process but also pave the way for future advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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