Wuhan, China

Qingnian Dai

This inventor holds 1 USPTO granted patent. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Qingnian Dai. Retrieved from https://idiyas.com/inventor/qingnian-dai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Qingnian Dai: Innovator in Vibration Damping Technology

Introduction: Qingnian Dai is a prominent inventor based in Wuhan, China. He has made significant contributions to the field of vibration damping technology. His innovative approach has led to the development of a unique device that addresses various challenges in controlling vibrations.

Latest Patents: Qingnian Dai holds a patent for a "Multi-directional broadband tuned mass damper and design method thereof." This invention features a first damping structure and a second damping structure mounted on a rigid vibration damping frame. The first damping structure is designed with a control main frequency, while the second damping structure incorporates two control main frequencies. The design allows for effective control of high frequencies and low frequencies, ensuring a comprehensive approach to vibration management.

Career Highlights: Throughout his career, Qingnian Dai has focused on enhancing the efficiency and effectiveness of vibration damping systems. His work has been recognized for its innovative design and practical applications in various industries. With a patent count of 1 patent, he continues to push the boundaries of technology in this field.

Collaborations: Qingnian Dai has collaborated with notable colleagues, including Weiqi Mao and Xiaobo Wu. Their combined expertise has contributed to the advancement of vibration damping technologies.

Conclusion: Qingnian Dai's contributions to the field of vibration damping technology exemplify his innovative spirit and dedication to solving complex engineering challenges. His patented inventions pave the way for future advancements in this critical area of research.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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