This inventor holds 1 USPTO granted patent. Top assignee: The South China University of Technology. Active years: 2021.
Company Filing History:
Years Active: 2021
Title: Qinghong Lin - Innovator in Pressure-Molding Technology
Introduction
Qinghong Lin is a notable inventor based in Guangdong, China. He has made significant contributions to the field of pressure-molding technology, particularly in the development of devices and methods that enhance product consistency and yield rates.
Latest Patents
Qinghong Lin holds a patent for a "Device and method for pressure-molding anti-overheating CSP fluorescent membrane." This invention discloses a device that includes a frame, a mould pressing device, a force measuring device, a control device, and a feeding device. The mould pressing device consists of an upper pressing mould, an upper clamp, a lower pressing mould, a guide post, an elastic supporting structure, and a lower clamp. The addition of an elastic supporting structure during the pressure molding process allows for a more stable increase in mould clamping force, reducing the force impact of the mould clamping device. This innovation effectively prevents overheating caused by prolonged contact between the lower clamp and the heating lower pressing mould, thereby improving the product consistency and yield rate of the CSP-package fluorescent membrane.
Career Highlights
Qinghong Lin is affiliated with the South China University of Technology, where he continues to advance his research and development efforts in innovative technologies. His work has garnered attention for its practical applications in manufacturing processes.
Collaborations
Qinghong Lin has collaborated with notable colleagues, including Zongtao Li and Yong Zhao Tang, to further enhance the impact of their research in the field of pressure-molding technology.
Conclusion
Qinghong Lin's contributions to pressure-molding technology exemplify the importance of innovation in improving manufacturing processes. His patent not only addresses critical issues related to overheating but also enhances the overall efficiency and quality of CSP-package fluorescent membranes.