Dongguan, China

Qingguo Tang

This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Huawei Technologies Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Qingguo Tang. Retrieved from https://idiyas.com/inventor/qingguo-tang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Qingguo Tang: Innovator in Electronic Packaging Technology

Introduction

Qingguo Tang is a notable inventor based in Dongguan, China. He has made significant contributions to the field of electronic packaging technology. His innovative work has led to the development of a unique packaging module that enhances the functionality of electronic devices.

Latest Patents

Qingguo Tang holds 1 patent for his invention titled "Packaging module, electronic device, and methods for manufacturing the same." This patent discloses a packaging module and an electronic device where both surfaces of a PCB are covered with a molding layer. A conductive pin is electrically connected to the PCB and is packaged inside the molding layer, allowing for efficient electrical interaction with other elements.

Career Highlights

Qingguo Tang is currently employed at Huawei Technologies Co., Ltd., a leading global provider of information and communications technology (ICT) infrastructure and smart devices. His work at Huawei has allowed him to push the boundaries of electronic packaging technology.

Collaborations

He has collaborated with talented coworkers such as Yatao Lv and Ning Wang, contributing to the advancement of innovative solutions in their field.

Conclusion

Qingguo Tang's contributions to electronic packaging technology exemplify the spirit of innovation. His work continues to influence the development of more efficient electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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