Location History:
- Raleigh, NC (US) (2015)
- Downers Grove, IL (US) (2015 - 2022)
Company Filing History:
Years Active: 2015-2022
Title: Qing Peng: Innovator in Nanoscale Domain Engineering
Introduction
Qing Peng is a prominent inventor based in Downers Grove, IL (US). She has made significant contributions to the field of nanotechnology, particularly in the development of methods for creating tunable inorganic patterned nanofeatures. With a total of 6 patents to her name, her work is at the forefront of innovation in material science.
Latest Patents
One of her latest patents involves a method of preparing tunable inorganic patterned nanofeatures by infiltration of a block copolymer scaffold. This method utilizes sequential infiltration synthesis (SIS), which is related to atomic layer deposition (ALD). The process includes selecting a metal precursor that selectively reacts with the copolymer unit defining the microdomain while being substantially non-reactive with another polymer unit of the copolymer. This innovative approach allows for the selective formation of tunable inorganic features on the microdomain, resulting in a hybrid organic/inorganic composite material. The organic component can be optionally removed to obtain inorganic features with patterned nanostructures defined by the configuration of the microdomain.
Career Highlights
Qing Peng is currently employed at UChicago Argonne, LLC, where she continues to push the boundaries of research in her field. Her work has garnered attention for its potential applications in various industries, including electronics and materials engineering.
Collaborations
She has collaborated with notable colleagues such as Jeffrey W. Elam and Seth B. Darling, contributing to a dynamic research environment that fosters innovation and discovery.
Conclusion
Qing Peng's contributions to the field of nanotechnology exemplify the impact of innovative thinking in science and engineering. Her patents and research continue to pave the way for advancements in material science and technology.