Shenzhen, China

Qin Wen

This inventor holds 1 USPTO granted patent. Top assignees: Hon Hai Precision Industry Co., Ltd., Hong-Fu Jin Precision Industry (Shenzhen) Co., Ltd.. Active years: 2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Qin Wen. Retrieved from https://idiyas.com/inventor/qin-wen-3yr6aq38

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: Qin Wen: Inventor of a Handmade Paper-Craft Design System

Introduction

Qin Wen is an inventor based in Shenzhen, China. His work includes a patent for a digital method of designing handmade paper crafts, combining three-dimensional craft models with customizable two-dimensional patterns. The available information lists 1 patent.

Latest Patents

“Method and System of Designing Handmade Paper Crafts” describes a process in which a client accesses a server and selects a three-dimensional paper-craft model from a database. The server generates a corresponding two-dimensional view that can be cut and folded to form the selected three-dimensional craft. In the pattern, dotted lines indicate where to cut, while solid lines indicate where to fold. Users can add pictures or words to the pattern and save the modified design back to the server.

Career Highlights

Qin Wen is associated with Hong-Fu Jin Precision Industry (Shenzhen) Co., Ltd. and Hon Hai Precision Industry Co., Ltd. His patent reflects an approach to making paper-craft design more accessible through digital tools and customizable templates.

Collaborations

Yi-Fang Wu is identified as a coworker of Qin Wen.

Conclusion

Qin Wen’s patent presents a server-based system for turning three-dimensional paper-craft concepts into customizable, cut-and-fold patterns, connecting digital design with hands-on craft making.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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