Qin Ren

Title: Innovations by Qin Ren in Acoustic Device Packaging

Introduction

Qin Ren is an accomplished inventor based in Singapore, known for his contributions to the field of semiconductor technology. His innovative work focuses on enhancing the performance of acoustic devices through advanced packaging structures.

Latest Patents

Qin Ren holds a patent for a "Packaging structure and method of acoustic device." This patent describes a unique packaging structure that includes a substrate and a piezoelectric stack structure. The design features a first organic material layer and a second organic material layer, which work together to improve the efficiency of acoustic wave reflection. The first supporting part and the second supporting part of the first organic material layer create a first acoustic reflection structure, which significantly reduces the loss of acoustic waves. This innovative approach enhances the overall performance of the acoustic device.

Career Highlights

Qin Ren is currently employed at Wuhan Memsonics Technologies Co., Ltd., where he continues to develop cutting-edge technologies in the semiconductor sector. His work has garnered attention for its practical applications and potential to revolutionize acoustic devices.

Collaborations

Qin Ren collaborates with talented professionals in his field, including Zhipeng Ding and Bowoon Soon. Their combined expertise contributes to the advancement of innovative solutions in acoustic technology.

Conclusion

Qin Ren's contributions to the field of acoustic device packaging demonstrate his commitment to innovation and excellence. His patent reflects a significant advancement in semiconductor technology, showcasing the potential for improved acoustic device performance.