Shenzhen, China

Qiao-Hua Du

This inventor holds 7 USPTO granted patents. Top assignee: Fih (Hong Kong) Limited. Active years: 2009-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Qiao-Hua Du. Retrieved from https://idiyas.com/inventor/qiao-hua-du

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 6

Forward Citations = 167(Granted Patents)


Company Filing History:


Years Active: 2009-2010

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7 patents (USPTO):Explore Patents

Title: Qiao-Hua Du: A Pioneer in Mobile Device Innovation

Introduction

Qiao-Hua Du is an accomplished inventor based in Shenzhen, China. With a remarkable portfolio of seven patents, he has significantly contributed to the field of mobile technology. His innovative work has positioned him as a key figure in the industry.

Latest Patents

Some of Qiao-Hua Du's latest patents include advancements such as a mobile phone design and a shell for an electronic device. These inventions exhibit his commitment to improving user experience and enhancing device functionality.

Career Highlights

Qiao-Hua Du is currently employed at FIH (Hong Kong) Limited, a company known for its manufacturing and design of electronic devices. His role at FIH has allowed him to collaborate with talented colleagues and drive innovation in mobile technology.

Collaborations

Throughout his career, Qiao-Hua Du has worked alongside esteemed coworkers such as Chao-Hsun Lin and Xiao-Ming Zhu. Their collaboration has fostered a creative environment, leading to the successful development of numerous inventions that push the boundaries of technology.

Conclusion

Qiao-Hua Du stands out as a visionary inventor whose contributions to mobile technology continue to influence the industry. With a solid track record of innovation and collaboration at FIH (Hong Kong) Limited, he remains dedicated to shaping the future of electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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