Karlsruhe, Germany

Qi Siegmundt-Pan

This inventor holds 6 USPTO granted patents. Top assignees: Agilent Technologies, Inc., Agilent Technology, Inc.. Active years: 2017-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Qi Siegmundt-Pan. Retrieved from https://idiyas.com/inventor/qi-siegmundt-pan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.2

ph-index = 2

Forward Citations = 35(Granted Patents)


Location History:

  • Waldbronn, DE (2017)
  • Karlsruhe, DE (2020 - 2023)

Company Filing History:


Years Active: 2017-2025

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6 patents (USPTO):Explore Patents

Title: Innovations of Qi Siegmundt-Pan

Introduction

Qi Siegmundt-Pan is an accomplished inventor based in Karlsruhe, Germany. He has made significant contributions to the field of packaging technology, holding a total of 6 patents. His innovative ideas have paved the way for advancements in touchless packaging solutions.

Latest Patents

One of his latest patents is the Touchless Package, which includes a base with at least one receptacle. This receptacle features a first portion with a first diameter and a second portion that has a bottom surface and a second diameter. The patent also discloses a method for removing a product from the package, showcasing his commitment to enhancing user experience and convenience.

Career Highlights

Throughout his career, Qi has worked with notable companies such as Agilent Technologies, Inc. and Agilent Technology, Inc. His experience in these organizations has contributed to his expertise in developing innovative packaging solutions.

Collaborations

Qi has collaborated with talented individuals, including Fanny Hauser and Cathrin Sohns. These partnerships have fostered a creative environment that encourages the development of groundbreaking ideas.

Conclusion

In summary, Qi Siegmundt-Pan is a notable inventor whose work in touchless packaging has garnered attention in the industry. His patents and collaborations reflect his dedication to innovation and improving product accessibility.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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