Chengdu, China

Qi Ming Bao

This inventor holds 1 USPTO granted patent. Top assignee: Texas Instruments Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Qi Ming Bao. Retrieved from https://idiyas.com/inventor/qi-ming-bao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 8.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Qi Ming Bao - Innovator in Ball Mounting Technology

Introduction

Qi Ming Bao is a notable inventor based in Chengdu, China. He has made significant contributions to the field of technology, particularly with his innovative designs and patents. His work is recognized for its practical applications and advancements in engineering.

Latest Patents

Qi Ming Bao holds a patent for a "Ball Mounting Apparatus with Ball Attach Volume Control." This invention showcases his ability to create solutions that enhance functionality and user experience in various applications.

Career Highlights

Currently, Qi Ming Bao is employed at Texas Instruments Corporation, a leading company in the semiconductor industry. His role at Texas Instruments allows him to work on cutting-edge technology and contribute to the development of innovative products.

Collaborations

Throughout his career, Qi Ming Bao has collaborated with talented individuals such as Bo Jiang and Wei Li. These partnerships have fostered a creative environment that encourages the exchange of ideas and expertise.

Conclusion

Qi Ming Bao is a distinguished inventor whose work in ball mounting technology exemplifies innovation and creativity. His contributions to Texas Instruments Corporation and the field of engineering continue to inspire future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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