This inventor holds 3 USPTO granted patents and 1 published patent application. Top assignee: Syracuse University. Active years: 2022-2026.
Company Filing History:
Years Active: 2022-2026
Title: Puskal Kunwar: Innovator in Hydrogel Fabrication Technology
Introduction
Puskal Kunwar is a notable inventor based in Syracuse, NY (US). He has made significant contributions to the field of hydrogel fabrication technology. With a total of 3 patents, his work focuses on advancing the capabilities of 3D printing techniques.
Latest Patents
Puskal Kunwar's latest patents include a hybrid additive-subtractive laser fabrication platform for shaping hydrogels. This innovative technology utilizes ultrafast lasers in sequential additive-subtractive modes to create intricate 3D hydrogel constructs. The approach combines additive crosslinking and subtractive ablation processes, which are typically considered mutually exclusive. The hybrid laser printing (HLP) technology can operate at virtually any penetration depth, allowing for the fabrication of multi-layer hydrogel constructs with micrometer resolution. HLP has been employed to print ready-to-use functional chips using commonly used hydrogels, aimed at potential cellular communication and migration applications. Additionally, HLP has proven compatible with in situ printing of cell-laden hydrogel constructs, making it possible to shape soft hydrogels into 3D multiscale functional devices.
Career Highlights
Puskal Kunwar is affiliated with Syracuse University, where he continues to push the boundaries of hydrogel technology. His work has garnered attention for its potential applications in various fields, including biomedical engineering and materials science.
Collaborations
Puskal collaborates with talented individuals such as Pranav Soman and Zheng Xiong, contributing to a dynamic research environment that fosters innovation.
Conclusion
Puskal Kunwar's contributions to hydrogel fabrication technology exemplify the spirit of innovation in modern science. His work not only advances the field but also opens new avenues for research and application.