Rantau, Malaysia

Pui Leng Low

USPTO Granted Patents = 2 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2023-2024

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2 patents (USPTO):Explore Patents

Title: Pui Leng Low: Innovator in Electronic Substrate Technology

Introduction

Pui Leng Low is a notable inventor based in Rantau, Malaysia. She has made significant contributions to the field of electronic substrates, particularly in the area of bonding module pins. With a total of two patents to her name, her work has advanced the technology used in electronic components.

Latest Patents

Pui Leng Low's latest patents focus on innovative methods for attaching terminal pins to circuit traces on electronic substrates. One of her patents describes a system that includes a sonotrode and a stage for holding the electronic substrate. The sonotrode is designed to direct ultrasound energy to the base region of the terminal pin, effectively welding it to the circuit trace. Additionally, the system features a three-dimensional positioner that allows for precise placement of the terminal pin on the electronic substrate. Another patent outlines a method that involves disposing a terminal pin on an electronic substrate and ultrasonically coupling it to the circuit trace, ensuring a strong and reliable connection.

Career Highlights

Pui Leng Low is currently employed at Semiconductor Components Industries, LLC, where she continues to innovate in the field of semiconductor technology. Her work has been instrumental in improving the efficiency and reliability of electronic devices.

Collaborations

Pui Leng Low has collaborated with talented coworkers such as Erik Nino Mercado Tolentino and Dennis Cadiz Yborde. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Pui Leng Low's contributions to electronic substrate technology through her patents and work at Semiconductor Components Industries, LLC highlight her role as a leading innovator in the field. Her advancements in bonding techniques are paving the way for more efficient electronic components.

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