Semiconductor Components Industries, LLC

Pui Leng Low

Shutesh Krishnan

Erik Nino Mercado Tolentino

Dennis Cadiz Yborde

A system for attaching a terminal pin to a circuit trace on an electronic substrate. The system includes a sonotrode and a stage for holding the electronic substrate. The sonotrode is configured to direct ultrasound energy to a base region of the terminal pin placed on the circuit trace to weld the base region to the circuit trace. The system further includes a three-dimensional positioner coupled to the sonotrode. The three-dimensional positioner is configured to drive the sonotrode to lift the terminal pin from a rack and to place the terminal pin on the electronic substrate.

Bonding module pins to an electronic substrate

A method includes disposing a terminal pin on an electronic substrate with a base region of the terminal pin in contact with a circuit trace on an electronic substrate, and ultrasonically coupling the base region of the terminal pin to the circuit trace.

Growing community of inventors

Rantau, Malaysia

Pui Leng Low