Seattle, WA, United States of America

Priya Dhalwani

This inventor holds 1 USPTO granted patent. Top assignee: Amazon Technologies, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Priya Dhalwani. Retrieved from https://idiyas.com/inventor/priya-dhalwani

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Priya Dhalwani and Application-Layer Prompt Reasoning

Introduction

Priya Dhalwani is an inventor associated with Seattle, Washington, and Amazon Technologies, Inc. Her patent work focuses on methods for structuring prompts to guide language models through task-specific reasoning.

Latest Patents

Dhalwani is associated with 1 patent: “Enhanced prompt reasoning at application layer for machine learning models.” The invention describes a process in which a language model first generates task-specific reasoning modules from an initial prompt. A subsequent prompt combines the original task with another task and one of those modules, directing the model to create an initial reasoning structure without yet providing an answer. This approach aims to organize the model’s reasoning before it responds.

Career Highlights

The available information identifies Dhalwani’s work with Amazon Technologies, Inc. and highlights her contribution to language-model prompt engineering. Her patent describes a staged method for generating reasoning structures at the application layer.

Collaborations

Dhalwani’s listed coworkers include Krishna Aswani and Huilin Lu. Their names are associated with her professional context, though the provided information does not specify their roles in the patent.

Conclusion

Priya Dhalwani’s patent presents a structured approach to prompting language models, using task-specific reasoning modules to shape how a model prepares to respond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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