This inventor holds 1 USPTO granted patent. Top assignee: National Semiconductor Corporation. Active years: 1998.
Company Filing History:
Years Active: 1998
Title: Poh Ling Lee - Innovator in Semiconductor Packaging
Introduction
Poh Ling Lee is a notable inventor based in Singapore, recognized for her contributions to the field of semiconductor packaging. With a focus on enhancing the efficiency and functionality of substrate boards, she has made significant strides in the industry.
Latest Patents
Poh Ling Lee holds a patent for a substrate board having an anti-adhesive solder mask. This innovative method involves creating substrate boards for use in packaging semiconductor devices. The design features a plurality of conductive traces patterned on at least one side, with an anti-adhesive solder mask applied over and around the conductive traces located at the outer portion of the substrate board. The center portion remains uncovered by the anti-adhesive solder mask material, resulting in a surface area that is substantially more adhesive than the outer portion.
Career Highlights
Poh Ling Lee is currently employed at National Semiconductor Corporation, where she continues to develop and refine technologies related to semiconductor packaging. Her work has been instrumental in advancing the capabilities of substrate boards, making them more effective for various applications.
Collaborations
Poh Ling Lee has collaborated with several professionals in her field, including Shaw Wei Lee and Anthony E Panczak. These partnerships have contributed to her innovative approach and the successful development of her patented technologies.
Conclusion
Poh Ling Lee's contributions to semiconductor packaging through her innovative patent demonstrate her expertise and commitment to advancing technology in this critical field. Her work continues to influence the industry and pave the way for future innovations.