Tainan, Taiwan

Po-I Lee

This inventor holds 1 USPTO granted patent. Top assignee: National Cheng-Kung University. Active years: 2006.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Po-I Lee. Retrieved from https://idiyas.com/inventor/po-i-lee-4ckhqmce

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2006

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1 patent (USPTO):Explore Patents

Title: Innovations of Po-I Lee in High Aspect Ratio Pattern Transfer

Introduction

Po-I Lee is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of pattern transfer technology. His innovative methods have the potential to enhance manufacturing processes in various industries.

Latest Patents

Po-I Lee holds a patent for a "Method for high aspect ratio pattern transfer." This invention utilizes a combination of imprint and Step and Flash techniques to effectively transfer high aspect ratio patterns. The method not only saves developing time but also reduces the amount of developer used during the photo-resist pattern transfer process. Additionally, it prevents separation and dissolution between the pattern and substrate, resulting in high-quality patterns.

Career Highlights

Po-I Lee is affiliated with National Cheng-Kung University, where he continues to advance research in his field. His work has garnered attention for its practical applications and innovative approach to pattern transfer.

Collaborations

Some of his notable coworkers include Min-Hsiung Hon and Lien-Chung Hsu. Their collaborative efforts contribute to the ongoing research and development in the area of pattern transfer technologies.

Conclusion

Po-I Lee's contributions to high aspect ratio pattern transfer demonstrate his commitment to innovation and excellence in the field. His work not only advances technology but also paves the way for future developments in manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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