Po Chun Yang

Title: Po Chun Yang: Innovator in Copper Foil Technology

Introduction

Po Chun Yang is a notable inventor based in Nantou, Taiwan. He has made significant contributions to the field of materials science, particularly in the development of advanced copper foil technologies. His innovative work has implications for various electronic applications, enhancing performance and reliability.

Latest Patents

Yang holds a patent for a roughened copper foil, copper-clad laminate, and printed wiring board. This invention provides a roughened copper foil capable of achieving both excellent transmission characteristics and suppression of powdering. The roughened copper foil includes a roughened surface on at least one side, with specific parameters that ensure its effectiveness. The roughness slope tan θ is 0.58 or less, calculated based on a mean height Rc (μm) and a mean width RSm (μm) of profile elements. Additionally, the sharpness index Rc×Sku is 2.35 or less, which is a product of the mean height Rc and a kurtosis Sku. These measurements are crucial for ensuring the quality and performance of the copper foil in various applications.

Career Highlights

Po Chun Yang is currently employed at Mitsui Mining & Smelting Co., Ltd. His work at this esteemed company has allowed him to focus on innovative solutions in the field of materials engineering. Yang's dedication to research and development has positioned him as a key player in advancing copper foil technology.

Collaborations

Yang has collaborated with talented coworkers, including Ayumu Tateoka and Tsubasa Kato. Their combined expertise has contributed to the successful development of innovative materials and technologies.

Conclusion

Po Chun Yang's contributions to the field of copper foil technology exemplify the importance of innovation in materials science. His patent for a roughened copper foil demonstrates his commitment to enhancing electronic performance. Yang's work continues to influence the industry, paving the way for future advancements.