Ping Lung Liao

Title: Innovations by Ping Lung Liao in BGA Package Technology

Introduction

Ping Lung Liao is a notable inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor technology, particularly in the development of devices for testing BGA (Ball Grid Array) packages. With a total of 2 patents, Liao's work has advanced the efficiency and reliability of electronic testing processes.

Latest Patents

Liao's latest patents include a BGA package holder device and a method for testing BGA packages. This innovative apparatus is designed to support BGA packages during various testing processes. The device features a substrate member equipped with multiple contact pads, strategically arranged around its peripheral region. Additionally, it includes several contact regions that are electrically connected to the contact pads, allowing for effective electrical contact with the balls on a BGA package. The holder device is engineered to securely hold the BGA package in place, ensuring reliable mechanical contact between the balls and the contact regions.

Career Highlights

Ping Lung Liao is currently employed at Semiconductor Manufacturing International (Shanghai) Corporation, where he continues to develop cutting-edge technologies in semiconductor manufacturing. His expertise in BGA package testing has positioned him as a key player in the industry.

Collaborations

Liao has collaborated with several talented individuals in his field, including Shan An Liang and Chun Kui Ji. These partnerships have fostered innovation and contributed to the successful development of new technologies.

Conclusion

Ping Lung Liao's contributions to BGA package technology exemplify the importance of innovation in the semiconductor industry. His patents and collaborative efforts continue to shape the future of electronic testing processes.