Kaohsiung, Taiwan

Ping-Hung Yu


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: **Innovator Ping-Hung Yu and His Contributions to Semiconductor Technology**

Introduction

Ping-Hung Yu, an accomplished inventor based in Kaohsiung, Taiwan, has made significant strides in the field of semiconductor technology. With a prolific mindset and innovative thinking, he has contributed to advancements that streamline processes in the semiconductor industry.

Latest Patents

Ping-Hung Yu holds a notable patent titled "Method of packing-based macro placement and semiconductor chip using the same - A multi-packing tree (MPT) macro placer." This innovative technology involves creating a k-level binary multi-packing tree that enhances the efficiency of macro placement. By reading input files in a LEF/DEF format, he designed an optimized packing structure that generates output files, ultimately improving the semiconductor chip design process.

Career Highlights

Currently, Ping-Hung Yu is associated with MediaTek Corporation, a leading global provider of semiconductor solutions. His role in the company allows him to apply his creative engineering skills to develop state-of-the-art technology that supports the growing demands of electronics.

Collaborations

Ping-Hung Yu collaborates with talented colleagues such as Tung-Chieh Chen and Yao-Wen Chang. Together, they leverage their collective expertise to push the boundaries of semiconductor innovations and contribute to the success of projects at MediaTek Corporation.

Conclusion

Ping-Hung Yu exemplifies the spirit of innovation within the technology sector. His contributions, particularly through his patent for the MPT macro placer, solidify his role as a crucial player in shaping the future of semiconductor chip designs. As the industry evolves, inventors like Ping-Hung Yu will continue to be at the forefront of technological advancements, driving progress and efficiency in semiconductor applications.

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