Ping-Chin Sun

Title: Ping-Chin Sun: Innovator in Micro Electromechanical Devices

Introduction

Ping-Chin Sun is a notable inventor based in Taipei Hsien, Taiwan. He has made significant contributions to the field of micro electromechanical devices, showcasing his expertise through innovative patent applications. His work focuses on enhancing the packaging processes of these devices, ensuring their durability and functionality.

Latest Patents

One of Ping-Chin Sun's key patents is titled "Wafer level packaging of micro electromechanical device." This invention provides a wafer level package that comprises a wafer containing multiple micro electromechanical devices and a package wafer of the same size. The design includes a plurality of conductor plugs that penetrate through both the upper and lower surfaces of the package wafer. Solder bumps are formed on these conductor plugs, allowing them to adhere to predetermined solder bumps on the micro electromechanical device wafer, ultimately forming a package device. This innovative packaging method effectively prevents damage to micro electromechanical devices during the packaging procedure. He holds 1 patent.

Career Highlights

Ping-Chin Sun is associated with Lightuning Tech. Inc., where he applies his expertise in micro electromechanical systems. His work at the company has been instrumental in advancing the technology and applications of these devices.

Collaborations

Throughout his career, Ping-Chin Sun has collaborated with notable colleagues, including Bruce C. S. Chou and Hsien-Ming Wu. These collaborations have contributed to the development of innovative solutions in the field of micro electromechanical devices.

Conclusion

Ping-Chin Sun's contributions to the field of micro electromechanical devices through his innovative patent demonstrate his commitment to advancing technology. His work not only enhances the functionality of these devices but also ensures their protection during packaging.