This inventor holds 5 USPTO granted patents. Top assignee: Au Optronics Corporation. Active years: 2005-2010.
Location History:
- Taipei, TW (2006)
- Yingge Township, Taipei County, TW (2006 - 2008)
- Taipei Hsien, TW (2005 - 2010)
Company Filing History:
Years Active: 2005-2010
Title: Innovations of Ping-Chin Cheng
Introduction
Ping-Chin Cheng is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of flexible printed circuit boards, holding a total of 5 patents. His work has advanced the technology used in various electronic devices, showcasing his expertise and innovative spirit.
Latest Patents
One of Cheng's latest patents is titled "Reel-type package of flexible printed circuit boards and method for supplying thereof." This invention discloses a method for reel-type packaging flexible printed circuit boards (FPCs). The process involves cutting a flexible plate with multiple FPC patterns to create several bar-like materials, each containing aligned FPCs. These materials are then wound onto a reel to prevent crumpling, curving, and deforming under external forces. Another significant patent is for "Liquid crystal display devices," which includes a thin film transistor array on a panel's first region. This device utilizes an anisotropic conductive film to bond integrated circuit chips and other components to a second region of the panel.
Career Highlights
Cheng is currently employed at Au Optronics Corporation, where he continues to innovate and develop new technologies. His work has been instrumental in enhancing the performance and reliability of electronic displays and components.
Collaborations
Cheng has collaborated with talented coworkers, including Chun-Yu Lee and Hui-Chang Chen, contributing to various projects and advancements in their field.
Conclusion
Ping-Chin Cheng's contributions to the field of flexible printed circuit boards and liquid crystal display devices highlight his innovative capabilities and dedication to technology. His patents reflect a commitment to improving electronic device functionality and reliability.
