Bangkok, Thailand

Pimpa Boonyatee

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Nxp B.v.. Active years: 2017-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Pimpa Boonyatee. Retrieved from https://idiyas.com/inventor/pimpa-boonyatee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 3.4

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2017-2019

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2 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Pimpa Boonyatee

Introduction

Pimpa Boonyatee is a notable inventor based in Bangkok, Thailand. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on improving the efficiency and functionality of semiconductor devices.

Latest Patents

One of his latest patents is titled "Lead frame with partially-etched connecting bar." This invention involves a lead frame strip that includes an array of lead frames, each featuring a die pad and lead fingers. The lead fingers are strategically spaced from the die pads and are disposed along one or more sides of the die pads. The connection bars extend between the lead frames, with the lead fingers of adjacent lead frames extending from opposing sides of the connection bars. The design includes etched portions that form a bar extending diagonally between adjacent lead fingers.

Another significant patent is the "Method of assembling semiconductor devices of varying thicknesses." This method outlines a process for packaging a semiconductor die, which includes mounting the die on a carrier and electrically connecting its contact pads to external contacts. The die is then encapsulated with a mold compound, and a unique thinning process is employed to trim the mold compound off the top of the package. This innovative approach allows for the simultaneous assembly of packages with varying thicknesses, streamlining the manufacturing process.

Career Highlights

Pimpa Boonyatee is currently employed at NXP B.V., a leading company in the semiconductor industry. His work at NXP has allowed him to develop and refine his innovative ideas, contributing to advancements in semiconductor technology.

Collaborations

Throughout his career, Pimpa has collaborated with talented coworkers such as Verapath Vareesantichai and Amornthep Saiyajitara. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Pimpa Boonyatee's contributions to the field of semiconductor technology are noteworthy. His innovative patents and collaborative efforts at NXP B.V. highlight his commitment to advancing the industry. His work continues to influence the development of more efficient semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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