Palo Alto, CA, United States of America

Pieter Coulier

This inventor holds 1 USPTO granted patent. Top assignee: Velo3d, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Pieter Coulier. Retrieved from https://idiyas.com/inventor/pieter-coulier-liw9cy02

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Pieter Coulier - Innovator in Three-Dimensional Printing

Introduction

Pieter Coulier is a notable inventor based in Palo Alto, CA (US). He has made significant contributions to the field of three-dimensional printing, particularly in developing methods that enhance the quality and complexity of 3D printed objects. His innovative approach addresses common challenges in the 3D printing process.

Latest Patents

Coulier holds a patent for "Three-dimensional printing of three-dimensional objects." This patent outlines methods, apparatuses, systems, and software designed to create one or more 3D objects, including complex structures. Notably, his methodologies allow for the formation of overhang portions with reduced deformation and defects, eliminating the need for auxiliary support structures.

Career Highlights

Pieter Coulier is currently associated with Velo3D, Inc., where he continues to push the boundaries of 3D printing technology. His work has been instrumental in advancing the capabilities of additive manufacturing, making it more efficient and versatile.

Collaborations

Coulier collaborates with talented individuals in the industry, including Tasso Lappas and Benyamin Buller. These partnerships enhance the innovative environment at Velo3D, Inc. and contribute to the development of cutting-edge technologies.

Conclusion

Pieter Coulier's contributions to three-dimensional printing exemplify the spirit of innovation in the field. His work not only addresses existing challenges but also paves the way for future advancements in 3D printing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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