Company Filing History:
Years Active: 1989-1990
Title: Pierre Merenda: Innovator in Multilayered Metal Networks
Introduction
Pierre Merenda is a notable inventor based in Aix en Provence, France. He has made significant contributions to the field of high-density integrated circuits, particularly in the development of methods for forming multilayered metal networks. With a total of 2 patents to his name, Merenda's work has had a substantial impact on the technology industry.
Latest Patents
Merenda's latest patents include innovative methods for forming multilayered metal networks for bonding components. The first patent describes a process in which a planarization layer is formed over a lower metal layer that includes conductors with steep edges. This method involves chemically depositing a dielectric layer in the vapor phase to fill hollows between the conductors, applying a viscous layer of spin-on-glass, and annealing it to create a compact mass. Vias are then formed through the layers to provide electrical contacts to the conductors of the lower metal layer.
The second patent also focuses on forming a planarization layer over a multilayered metal network. In this method, a layer of spin-on-glass is applied over the lower metal layer to create a thin film over the conductors. The spin-on-glass layer is uniformly etched to expose the upper surfaces of the conductors, followed by the application of a dielectric layer onto the etched spin-on-glass layer and the conductors.
Career Highlights
Pierre Merenda is currently associated with Bull S.A., a company known for its expertise in information technology and high-performance computing. His work at Bull S.A. has allowed him to explore and develop advanced technologies in integrated circuits.
Collaborations
Merenda has collaborated with notable colleagues such as Philippe Chantraine and Daniel Lambert. These collaborations have contributed to the advancement of his research and the successful development of his patents.
Conclusion
Pierre Merenda is a distinguished inventor whose work in multilayered metal networks has significantly influenced the field of integrated circuits. His innovative methods and collaborations continue to drive advancements in technology.