Company Filing History:
Years Active: 2007-2015
Title: Pia Frei: Innovator in Hot-Melt Adhesive Technologies
Introduction
Pia Frei is a notable inventor based in Rickenbach, Switzerland. She has made significant contributions to the field of hot-melt adhesive technologies, holding two patents that showcase her innovative spirit and technical expertise.
Latest Patents
Her latest patents include a hot-melt composition comprising hydrocolloids. This formulation is particularly useful as a wound dressing, featuring a chemically crosslinked polymer matrix that is obtainable from prepolymers crosslinkable by means of photopolymerization. The hydrocolloids are embedded within the chemically crosslinked polymer matrix. The formulation is created by combining the prepolymers and hydrocolloids, followed by heating and processing the mixture through a slot die, ensuring that the mixture maintains a viscosity of less than 100 Pa*s and a processing temperature of less than 150°C. The prepolymers are crosslinked through photopolymerization via UV light irradiation. Another significant patent is for a hot-melt pressure-sensitive adhesive composition. This composition utilizes a hydrogenated styrene-butadiene-butylene-styrene block copolymer, which enhances immediate adhesion properties and allows for the removal of the adhesive from a carrier substrate without leaving any residue.
Career Highlights
Throughout her career, Pia has worked with prominent companies such as Henkel and Nolax AG. Her experience in these organizations has contributed to her development as an inventor and her understanding of adhesive technologies.
Collaborations
Pia has collaborated with notable individuals in her field, including Andreas Dobmann and Judith Nyffeler. These partnerships have likely enriched her work and expanded her innovative capabilities.
Conclusion
Pia Frei's contributions to hot-melt adhesive technologies through her patents reflect her dedication to innovation and her expertise in the field. Her work continues to influence the development of advanced adhesive solutions.