Bruchkoebel, Germany

Pia Buckel

USPTO Granted Patents = 3 

 

Average Co-Inventor Count = 3.6

ph-index = 1

Forward Citations = 5(Granted Patents)


Location History:

  • Bruchköbel, DE (2011)
  • Bruchkoebel, DE (2012 - 2013)

Company Filing History:


Years Active: 2011-2013

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3 patents (USPTO):Explore Patents

Title: Pia Buckel: Innovator in Silica and Epoxy Resins

Introduction

Pia Buckel is a prominent inventor based in Bruchkoebel, Germany. She has made significant contributions to the field of materials science, particularly in the development of silica and epoxy resins. With a total of 3 patents to her name, Pia has established herself as a key figure in her industry.

Latest Patents

Pia's latest patents include innovative formulations of silica and epoxy resins. One notable patent describes a fumed silicon dioxide powder that consists of aggregated primary particles with a BET surface area of 175±15 m²/g. This hydrophobicized silica, treated with polydimethylsiloxane, exhibits a thickening effect greater than 18 mPas g/m. Additionally, she has developed epoxy resins that can be utilized as adhesives, featuring silanized, structurally modified, pyrogenically prepared silicas. These adhesives contain fixed vinyl groups or vinylsilyl groups, along with hydrophobic groups such as trimethylsilyl and/or dimethylsilyl and/or monomethylsilyl.

Career Highlights

Pia Buckel is currently employed at Evonik Degussa GmbH, where she continues to push the boundaries of innovation in her field. Her work has garnered attention for its practical applications in various industries, particularly in the production of adhesives.

Collaborations

Throughout her career, Pia has collaborated with notable colleagues, including Mario Scholz and Juergen Meyer. These partnerships have contributed to her success and the advancement of her research.

Conclusion

Pia Buckel is a trailblazer in the field of silica and epoxy resins, with a strong portfolio of patents that reflect her innovative spirit. Her contributions to materials science continue to impact various applications, particularly in adhesive technologies.

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