Johor Bahru, Malaysia

Phui Phoong Chuang


Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2014-2015

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2 patents (USPTO):Explore Patents

Title: Phui Phoong Chuang: Innovator in Wire Bonding Technology

Introduction

Phui Phoong Chuang is a notable inventor based in Johor Bahru, Malaysia. He has made significant contributions to the field of wire bonding technology, holding a total of 2 patents. His innovative designs have enhanced the efficiency and effectiveness of wire bonding machines.

Latest Patents

Chuang's latest patents include a lead frame support plate and a window clamp for wire bonding machines. The lead frame support plate features a network of suction grooves on its support surface. Each suction groove is designed to be in fluid communication with at least one vacuum hole, allowing a suction force to be generated. This design effectively holds a lead frame against the support surface. Additionally, the window clamp includes slots that compensate for deformation, further improving the functionality of wire bonding machines.

Career Highlights

Chuang is currently employed at Asm Technology Singapore Pte Ltd, where he continues to innovate in the field of wire bonding technology. His work has been instrumental in advancing the capabilities of wire bonding machines, making them more reliable and efficient.

Collaborations

Chuang has collaborated with notable coworkers, including Hasrul Bin Hasim and Wan Azmi. Their teamwork has contributed to the successful development of innovative solutions in their field.

Conclusion

Phui Phoong Chuang is a distinguished inventor whose work in wire bonding technology has led to significant advancements. His patents reflect his commitment to innovation and excellence in engineering.

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