This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 1993.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1993
Title: Phong T Truong: Innovator in Fine Pitch Solder Application
Introduction
Phong T Truong is an accomplished inventor based in Round Rock, TX (US). He has made significant contributions to the field of solder application technology. His innovative approach focuses on enhancing the precision of solder application for fine pitch leads, which are crucial in modern electronic devices.
Latest Patents
Phong T Truong holds 1 patent for his invention titled "Fine pitch solder application." This patent describes methods and apparatus for applying solder in precise amounts to fine pitch leads suitable for direct chip attachment (DCA) or flip-chip applications. The invention utilizes a heated platen to apply pressure to solder overlaying a plurality of lands on a circuitized substrate. In one embodiment, paste solder is screened through a mask with apertures corresponding to land locations. Another embodiment involves accurately positioning a web of solder foil over fine pitch lands. Each embodiment features a heated platen with active elements tailored to the area of the fine pitch lands.
Career Highlights
Phong T Truong is currently employed at International Business Machines Corporation (IBM). His work at IBM has allowed him to develop and refine his innovative solder application techniques. His contributions have been instrumental in advancing the capabilities of electronic manufacturing processes.
Collaborations
Phong has collaborated with notable colleagues, including Arthur L Leerssen and Everitt W Mace. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Phong T Truong's work in fine pitch solder application exemplifies the spirit of innovation in the electronics industry. His patent and contributions at IBM highlight his commitment to advancing technology in solder application methods.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
