Ebenhausen, Germany

Phillip Von Schmidt

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Eagleburgmann Germany Gmbh & Co. Kg. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Phillip Von Schmidt. Retrieved from https://idiyas.com/inventor/phillip-von-schmidt

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile



Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Phillip Von Schmidt: Inventor of a Sensor-Equipped Mechanical Seal

Introduction

Phillip Von Schmidt is an inventor based in Ebenhausen, Germany. His listed patent work concerns a mechanical seal arrangement that integrates sensors and a combined cable connection. He is associated with EagleBurgmann Germany GmbH & Co. KG.

Latest Patents

Von Schmidt is credited with 1 patent: “Mechanical Seal Arrangement with Sensor Arrangement.” The invention describes a mechanical seal with rotating and stationary slide rings that form a sealing gap between their sliding surfaces. It also features a pre-assembled group containing two sensors and their respective cable arrangements. The cables are brought together into a common cable harness, which ends in a multipole combination plug with multiple contacts.

Career Highlights

The patent reflects work on integrating sensor components and electrical connections into a mechanical seal assembly. Such an arrangement brings the sensors’ cable connections together through a shared harness and plug.

Collaborations

Von Schmidt is associated with EagleBurgmann Germany GmbH & Co. KG. His listed coworker is Michael Müller.

Conclusion

Phillip Von Schmidt’s recorded invention combines a mechanical seal with sensors and a consolidated cable connection, representing his documented contribution to industrial sealing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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