Location History:
- Phoenix, AZ (US) (1998)
- Chandler, AZ (US) (1999 - 2000)
Company Filing History:
Years Active: 1998-2000
Title: Innovations by Phillip C Celaya
Introduction
Phillip C Celaya is a notable inventor based in Chandler, Arizona. He has made significant contributions to the field of microelectronics, holding three patents to his name. His work primarily focuses on the development of advanced microelectronic packages.
Latest Patents
One of his latest patents is for a microelectronic package that includes a polymer encapsulated die. This innovative package features an integrated circuit die attached to a substrate through solder bump interconnections. The design includes a gap between the active face of the die and the substrate, allowing for efficient thermal management. The encapsulation process involves a mold that defines a cavity around the die, where a polymeric precursor is dispensed and cured to form a protective encapsulant.
Career Highlights
Phillip C Celaya has spent a significant part of his career at Motorola Corporation, where he has been instrumental in advancing microelectronic technologies. His expertise in the field has led to the successful development of several patented technologies that enhance the performance and reliability of electronic devices.
Collaborations
Throughout his career, Phillip has collaborated with notable colleagues, including Francis J Carney, Jr and George Amos Carson. These partnerships have contributed to the innovative solutions developed within the microelectronics sector.
Conclusion
Phillip C Celaya's contributions to microelectronics through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the development of advanced electronic packaging solutions.