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For the Inventor, By the Inventor

Los Angeles, CA, United States of America

Phillip Brown

This inventor holds 16 USPTO granted patents and 1 published patent application and 7 EPO patents, primarily in Service Layer Technologies. Top assignee: Convida Wireless, LLC. Active years: 2019-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Phillip Brown. Retrieved from https://idiyas.com/inventor/phillip-brown

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 16 

% Patents Active = 100.0

 

Average Co-Inventor Count = 8.7

ph-index = 2

Forward Citations = 17(Granted Patents)


Company Filing History:

goldMedal16 out of 367 
 
Convida Wireless, LLC
 patents

Years Active: 2019-2025

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Areas of Expertise:
Service Layer
Session Migration
Third Party Access
IoT Devices
M2M Interworking
Resource Link Management
Network Node Prediction
Charging Correlation
MQTT Protocol
Network Availability
16 patents (USPTO):Explore Patents
1. 12301681 - Systems and methods for enabling access to third party services via a service layer (2025-05-13),
2. 12278873 - Systems and methods for service layer session migration and sharing (2025-04-14),
3. 11888942 - Systems and methods for service layer session migration and sharing (2024-01-30),
4. 11882195 - Systems and methods for enabling access to third party services via a service layer (2024-01-23),
5. 11616851 - Systems and methods for enabling access to third party services via a service layer (2023-03-28),
6. 11601555 - Methods and apparatuses for service layer charging correlation with underlying networks (2023-03-07),
7. 11240321 - Systems and methods for enabling access to third party services via a service layer (2022-02-01),
8. 11134365 - Resource link management at service layer (2021-09-28),
9. 11064033 - Systems and methods for service layer session migration and sharing (2021-07-13),
10. 10999380 - Method and apparatus of interworking M2M and IoT devices and applications with different service layers (2021-05-04),
11. 10992820 - Methods and apparatuses for service layer charging correlation with underlying networks (2021-04-27),
12. 10931762 - Systems and methods for enabling access to third party services via a service layer (2021-02-23),
13. 10637747 - Network node availability prediction based on past history data (2020-04-28),
14. 10367896 - Service layer session migration and sharing (2019-07-30),
15. 10313858 - Service layer interworking using MQTT protocol (2019-06-04),

Title: Inventor Phillip Brown: Revolutionizing Industries with Innovation

Introduction: Phillip Brown, a visionary inventor based in Los Angeles, CA, is renowned for his groundbreaking contributions to various industries through his innovative creations and patents.

Latest Patents: Phillip Brown's latest patents include a cutting-edge technology for renewable energy storage, a revolutionary medical device for non-invasive surgeries, and a unique software solution for optimizing supply chain management.

Career Highlights: With a career spanning over two decades, Phillip Brown has established himself as a prolific inventor with a keen eye for identifying gaps in the market and developing inventive solutions. His patents have significantly impacted sectors such as healthcare, technology, and environmental sustainability.

Collaborations: Throughout his career, Phillip Brown has collaborated with leading research institutions, universities, and multinational companies to bring his inventions to life. His ability to work seamlessly in multidisciplinary teams has led to the successful commercialization of several patented technologies.

Conclusion: Phillip Brown's relentless pursuit of innovation and his passion for creating solutions to complex challenges have solidified his position as a trailblazing inventor in the industry. His patents continue to inspire future generations of inventors to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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