Phillip B Nicholson

Title: Innovations of Phillip B Nicholson

Introduction

Phillip B Nicholson is a notable inventor based in San Jose, California. He has made significant contributions to the field of semiconductor processing equipment. With a total of 2 patents, his work has had a considerable impact on the industry.

Latest Patents

One of his latest patents is titled "Clamp with wafer release for semiconductor wafer processing equipment." This invention describes an apparatus for releasably clamping a substrate to a support platform at the face of the substrate. In one embodiment, a retractable clamp holds the substrate near its edges when in its fully extended position. The design includes one or more leaf springs mounted to the clamp, which apply force to the substrate at respective points if the substrate adheres to the clamp, thereby facilitating its release. Additionally, activators are positioned in a cooperative relationship to the leaf springs, causing them to retract into recesses in the clamp when extended against the substrate. This innovative design minimizes particle contamination and reduces the chance of the leaf springs adhering to the substrate.

Career Highlights

Throughout his career, Phillip B Nicholson has worked with various companies, including Varian Associates, Inc. His experience in the semiconductor industry has allowed him to develop advanced technologies that enhance processing efficiency and reliability.

Collaborations

Phillip has collaborated with notable individuals such as Adolphus E McClanahan and Frederick T Turner. These partnerships have contributed to the development of innovative solutions in semiconductor technology.

Conclusion

Phillip B Nicholson's contributions to semiconductor processing equipment through his patents and collaborations highlight his role as a significant inventor in the field. His innovative designs continue to influence the industry and pave the way for future advancements.