Location History:
- Kokomo, IN (US) (1983 - 1987)
- Raleigh, NC (US) (1988)
Company Filing History:
Years Active: 1983-1988
Title: The Innovations of Phillip A. Lutz
Introduction
Phillip A. Lutz is a notable inventor based in Kokomo, IN (US). He has made significant contributions to the field of integrated circuit packaging, holding a total of 4 patents. His work has been instrumental in advancing technology in this area.
Latest Patents
Lutz's latest patents include a "Surface mountable integrated circuit package equipped with sockets." This innovative design features a surface mount package formed by nesting an encapsulated tape automated bonding integrated circuit module between two plastic rings that are snapped together. The inner surface of the outer ring contains recessed sockets for receiving socket pins that stand up on a circuit board. Another significant patent is the "Surface mount package for encapsulated tape automated bonding integrated," which also involves a similar nesting technique for the integrated circuit module.
Career Highlights
Phillip A. Lutz is currently employed at GM Global Technology Operations, Inc. His role at the company allows him to apply his expertise in integrated circuit technology and contribute to the development of cutting-edge solutions.
Collaborations
Throughout his career, Lutz has collaborated with several talented individuals, including Mark Anthony Koors and Phillip R. Motz. These collaborations have fostered innovation and creativity in their projects.
Conclusion
Phillip A. Lutz's contributions to integrated circuit packaging demonstrate his commitment to innovation and technology. His patents reflect a deep understanding of the complexities involved in circuit design and packaging.