Gm Global Technolgoy Operations, Inc.

Phillip A Lutz

Mark Anthony Koors

Charles T Eytcheson

Phillip R Motz

Eugene H Sayers

Harold L Fields

James E Jung

A surface mount package formed by nesting an encapsulated tape automated bonding integrated circuit module in between two plastic rings snapped together, the inner surface of the outer ring contains recessed sockets for receiving socket pins upstanding on a circuit board.

Surface mountable integrated circuit package equipped with sockets

A surface mount package formed by nesting an encapsulated tape automated bonding integrated circuit module in between two plastic rings snapped together.

Surface mount package for encapsulated tape automated bonding integrated

A lead frame for a molded semiconductor device package. The lead frame has a pattern of finger leads with convergent free inner ends and dam bars between adjacent finger leads. The dam bars are partially severed from their contiguous finger leads due to cuts on their edges intended to face a body member molded over the finger lead inner ends. The partially severed dam bar edge is preferably positioned to be substantially at the periphery of the molded body member. The resultant molded body member can thus have a finished surface even between the finger leads as molded and dam bar cutting die wear reduced.

Lead frame for molded integrated circuit package

A compact assembly of similar type integrated circuit packages having a functionally similar terminal lead in non-corresponding lead positions. Two interconnection packages, of a type similar to the integrated circuit packages, are nested between the integrated circuit packages to re-route an electrical path from a terminal lead location on one integrated circuit package to a functionally similar but differently located lead position on the other integrated circuit package.

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Kokomo, IN, United States of America

Phillip A Lutz