Vestal, NY, United States of America

Phillip A Hartley

This inventor holds 3 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 1983-1996.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Phillip A Hartley. Retrieved from https://idiyas.com/inventor/phillip-a-hartley

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.5

ph-index = 3

Forward Citations = 46(Granted Patents)


Company Filing History:


Years Active: 1983-1996

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3 patents (USPTO):Explore Patents

Title: **Innovative Contributions of Phillip A. Hartley**

Introduction

Phillip A. Hartley is a distinguished inventor based in Vestal, NY. With a commendable portfolio of three patents, Hartley has made significant contributions to the field of printed circuit board design and fabrication. His pioneering methods enhance the capabilities of multi-layer circuit boards, which are essential in modern electronic devices.

Latest Patents

Among Hartley's latest inventions is a method and apparatus for the cross-sectional design of multi-layer printed circuit boards. This innovative design tool streamlines the fabrication process by utilizing a knowledge base that incorporates both geometric parameters and performance metrics. The process begins with users entering specific design parameters, after which the tool applies production rules to generate optimal cross-section designs. This method significantly improves manufacturability, reduces costs, and facilitates effective testing procedures for electronic components.

Career Highlights

Phillip Hartley has built a successful career at the International Business Machines Corporation (IBM), where he has been instrumental in advancing technology in printed circuit board design. His expertise in this domain has helped IBM maintain its reputation as a leader in the field of electronics and computer engineering.

Collaborations

Throughout his career, Hartley has worked alongside talented professionals such as Chi Shih Chang and Subahu Dhirubhai Desai. Their collaborative efforts in research and development have further enriched the advancements in multi-layer printed circuit technology, allowing for improved performance and efficiency.

Conclusion

Phillip A. Hartley's innovative contributions in the technology sector, particularly in the development of multi-layer printed circuit boards, illustrate the importance of invention and collaboration in advancing engineering practices. His work not only enhances the capabilities of electronic devices but also sets a standard for future innovations in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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