This inventor holds 1 USPTO granted patent. Top assignee: Rf360 Singapore Pte. Ltd.. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: The Innovations of Philipp Schwegler
Introduction
Philipp Schwegler is an accomplished inventor based in Bavaria, Germany. He has made significant contributions to the field of electroacoustic devices, particularly in wireless communication technologies. His innovative work has led to the development of a unique patent that addresses challenges in bulk wave suppression.
Latest Patents
Philipp Schwegler holds a patent for "Stacked acoustic wave (AW) packages with reduced excitation of reflected bulk waves." This patent focuses on devices, wireless communication apparatuses, methods, and circuitry that implement bulk wave suppression in a stacked electroacoustic device. The invention includes a first substrate with a first surface and a second surface, where a first AW resonator circuit is positioned on the first surface. Additionally, a plurality of elements, including a first element aligned with the first AW resonator circuit, are positioned on the second surface of the first substrate. A second substrate also plays a crucial role in creating a cavity between the two substrates.
Career Highlights
Philipp Schwegler is currently employed at Rf360 Singapore Pte. Ltd., where he continues to push the boundaries of innovation in his field. His work has garnered attention for its practical applications in enhancing wireless communication systems.
Collaborations
Throughout his career, Philipp has collaborated with notable colleagues such as Peter Kirchhofer and Simone Colasanti. These partnerships have contributed to the advancement of his projects and the successful implementation of his inventions.
Conclusion
Philipp Schwegler's contributions to the field of electroacoustic devices exemplify the spirit of innovation. His patent on stacked acoustic wave packages showcases his commitment to improving wireless communication technologies.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile