Mount Washington, KY, United States of America

Philip R Moore

This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Lantech, Inc.. Active years: 1988.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Philip R Moore. Retrieved from https://idiyas.com/inventor/philip-r-moore-xvmy2dw7

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 14(Granted Patents)


Company Filing History:


Years Active: 1988

Loading Chart...
1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Philip R. Moore

Introduction

Philip R. Moore is a notable inventor based in Mt. Washington, KY (US). He has made significant contributions to the field of packaging technology. His innovative approach has led to the development of a unique method and apparatus for severing packaging material during a continuous wrapping process.

Latest Patents

Moore holds a patent for a "Method and apparatus for severing packaging material between successive wrapped loads." This invention provides a solution for severing packaging material that extends between successive wrapped loads. The apparatus includes a severing bar equipped with a heating element, which is essential for the efficient operation of the wrapping process.

Career Highlights

Throughout his career, Philip R. Moore has been associated with Lantech, Inc., a company known for its advancements in packaging machinery. His work has focused on improving the efficiency and effectiveness of packaging processes, which has had a positive impact on the industry.

Collaborations

Moore has collaborated with William G. Lancaster, contributing to the development of innovative packaging solutions. Their teamwork has fostered advancements in the technology used in the packaging sector.

Conclusion

Philip R. Moore's contributions to packaging technology through his patent and work at Lantech, Inc. highlight his role as an influential inventor in the industry. His innovative methods continue to shape the future of packaging processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…