Philip Joseph Lauriello

Title: The Innovations of Philip Joseph Lauriello

Introduction

Philip Joseph Lauriello is a notable inventor based in Holmdel, NJ (US). He holds a total of four patents, showcasing his contributions to the field of electronics and engineering. His work primarily focuses on multilayer electronics assemblies and methods for embedding electrical circuit components.

Latest Patents

One of Lauriello's latest patents is titled "Multilayer electronics assembly and method for embedding electrical circuit components within a three-dimensional module." This invention provides a multilayer electronics assembly that includes a plurality of stacked substrate layers. Each substrate layer is fusion bonded to at least one adjacent layer. A first discrete electrical circuit component is bonded to the first layer of the assembly, with a bonding material interposed between the component and the layer. This bonding material has a reflow temperature that is higher than the fusion bonding temperature of the substrate layers, ensuring durability and functionality.

Career Highlights

Throughout his career, Lauriello has worked with prominent companies such as Crane Electronics, Inc. and Lucent Technologies Inc. His experience in these organizations has contributed significantly to his expertise in electronics and innovation.

Collaborations

Laureillo has collaborated with notable individuals in his field, including Ernest Clyde Parker and Vibha Prakash Goel. These collaborations have likely enriched his work and led to further advancements in his inventions.

Conclusion

Philip Joseph Lauriello's contributions to the field of electronics through his innovative patents and collaborations highlight his significant role as an inventor. His work continues to influence the development of multilayer electronics assemblies, showcasing the importance of innovation in technology.