Crane Electronics, Inc.

Lucent Technologies Inc.

Merrimac Industries, Inc.

Philip Joseph Lauriello

Ernest Clyde Parker

Steven R Johnson

Frank J Peragine

Stan Lumish

Vibha Prakash Goel

Joseph P Kunz

A multilayer electronics assembly and associated method of manufacture are provided. The multilayer electronics assembly includes a plurality of stacked substrate layers. Each of the substrate layers is fusion bonded to at least an adjacent one of the plurality of substrate layers. A first discrete electrical circuit component is bonded to a first layer of the plurality of layers. A bonding material is interposed between the discrete electrical circuit component and the first layer. The bonding material has a reflow temperature at which the bonding material becomes flowable that is higher than a fusion bonding temperature of the substrate layers.

Multilayer electronics assembly and method for embedding electrical circuit components within a three dimensional module

A signal processing module can be manufactured from a plurality of composite substrate layers, each substrate layer includes elements of multiple individual processing modules. Surfaces of the layers are selectively metalicized to form signal processing elements when the substrate layers are fusion bonded in a stacked arrangement. Prior to bonding, the substrate layers are milled to form gaps located at regions between the processing modules. Prior to bonding, the leads are positioned such that they extend from signal coupling points on said metalicized surfaces into the gap regions. The substrate layers are then fusion bonded to each other such that the plurality of substrate layers form signal processing modules with leads that extend from an interior of the modules into the gap areas. The individual modules may then be separated by milling the substrate layers to de-panel the modules.

Fusion bonded assembly with attached leads

The invention is directed to an optical node, e.g., a so-called add/drop site, that receives an optical carrier signal formed from a plurality of component optical signals of respective wavelengths and a plurality of different identification signals which identify respective ones of the wavelengths. As is typically the case, the node includes a demultiplexer that demultiplexes the optical carrier signal and outputs the demultiplexed component optical signals to respective optical paths. Disadvantageously, each of the demultiplexed optical component signals includes all of the identification signals as a result of such demultiplexing. However, we dispose an optical translator unit in at least one of the optical paths to remove all of the identification signals from the one component optical signals and also reset the power level of that signal. A transmitter in the translator unit outputs the latter signal as an optical signal in which the wavelength of the outputted optical signal may be changed on an optional basis to a wavelength that is different from the wavelength of the one component optical signal.

Optical signal translator unit

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Holmdel, NJ, United States of America

Philip Joseph Lauriello