Unterentfelden, Switzerland

Philip Gerber

This inventor holds 1 USPTO granted patent and 2 EPO patents. Top assignee: Alstom Technology Limited. Active years: 2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Philip Gerber. Retrieved from https://idiyas.com/inventor/philip-gerber

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile



Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: The Innovations of Philip Gerber

Introduction

Philip Gerber is an accomplished inventor based in Unterentfelden, Switzerland. He holds a patent for a unique securing device designed for gas-insulated substations (GIS). His innovative approach has contributed to advancements in the field of electrical engineering.

Latest Patents

Gerber's notable patent is a securing device for GIS. This fastener device features a threaded shank and a ring that includes a duct configured to receive the threaded shank. The ring is housed in a supporting insulator, showcasing Gerber's ingenuity in enhancing the functionality of GIS installations. He has 1 patent to his name.

Career Highlights

Throughout his career, Philip Gerber has worked with prominent companies such as Alstom Technology Limited and General Electric Technology GmbH. His experience in these organizations has allowed him to refine his skills and contribute to significant projects in the industry.

Collaborations

Gerber has collaborated with notable professionals in his field, including Robert Lüscher and Lukas Treier. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Philip Gerber's contributions to the field of electrical engineering through his innovative securing device for GIS exemplify his dedication to advancing technology. His work continues to influence the industry and inspire future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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