Location History:
- Salt Lake City, UT (US) (1980)
- Sprinfield, VA (US) (2011)
Company Filing History:
Years Active: 1980-2011
Title: The Innovative Contributions of Philip E Thompson
Introduction
Philip E Thompson is a notable inventor based in Springfield, VA (US). He has made significant contributions to the field of technology, particularly in the development of advanced semiconductor devices and mineral processing techniques. With a total of 2 patents, his work reflects a commitment to innovation and practical applications.
Latest Patents
Thompson's latest patents include groundbreaking advancements in interband tunneling diodes. One of his patents focuses on Si/SiGe interband tunneling diodes with tensile strain. These devices comprise a plurality of substantially coherently strained layers, including silicon, germanium, and their alloys. At least one of these layers is tensile strained, enhancing the performance of the diodes. Another patent addresses the froth flotation of insoluble slimes from sylvinite ores. This technique involves treating sylvinite ores to remove insoluble slimes using nonionic or polyacrylamide flocculants, followed by flotation with a mixture of fuel oil or fatty acid and a defoamer.
Career Highlights
Throughout his career, Thompson has worked with esteemed organizations, including the United States of America as represented by the Secretary of and The Ohio State University. His experience in these institutions has allowed him to contribute to significant research and development projects.
Collaborations
Thompson has collaborated with notable colleagues such as Jerry L Huiatt and Don C Seidel. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Philip E Thompson's contributions to technology and innovation are evident through his patents and collaborations. His work continues to influence the fields of semiconductor technology and mineral processing, showcasing the importance of inventive thinking in solving complex challenges.