This inventor holds 1 USPTO granted patent. Top assignee: Tsrc Corporation. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: The Innovations of Philip Chung-Ming Yang
Introduction
Philip Chung-Ming Yang is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of adhesive technology. His innovative work has led to the development of a unique pressure-sensitive adhesive composition.
Latest Patents
Yang holds a patent for a "Pressure sensitive adhesive composition and protective film employing the same." This invention includes a pressure-sensitive adhesive composition that consists of 30-45 parts by weight of a tackifier and 55-70 parts by weight of a polymer. The polymer features at least one block copolymer, which is composed of a vinyl aromatic block polymerized by a vinyl aromatic monomer and a conjugated diene block polymerized by a conjugated diene monomer. The block copolymer meets specific conditions regarding the content of the vinyl aromatic monomer and the vinyl group of the conjugated diene block.
Career Highlights
Philip Chung-Ming Yang is currently associated with Tsrc Corporation, where he continues to innovate in adhesive technologies. His work has garnered attention for its practical applications in various industries.
Collaborations
Yang has collaborated with notable coworkers, including Wen-Pin Tsai and Hsi-Hsin Shih, contributing to advancements in their field.
Conclusion
Philip Chung-Ming Yang's contributions to adhesive technology exemplify the spirit of innovation. His patent reflects a commitment to developing effective solutions in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile