Philip Cheung

Title: **Innovator Spotlight: Philip Cheung of Roseville, MN**

Introduction

Philip Cheung, a notable inventor based in Roseville, Minnesota, has made significant contributions to the field of integrated circuit packaging and radio frequency technology. With a total of three patents under his name, Cheung's work demonstrates a commitment to advancing technological capabilities in electronic design.

Latest Patents

Cheung’s latest inventions showcase his expertise in integrating complex electronic components. His first patent, titled "Circuit Package Integrating Passive Radio Frequency Structure," focuses on the integration of passive radio frequency (RF) structures within a single integrated circuit (IC) package. This innovative design allows for the combination of a radio IC, digital IC, passive RF balun, and additional passive components, all within a multi-layer ceramic package. This design helps in effectively managing impedance matching through varying thickness and length of conductive traces.

Another significant success is his patent for a "Multi-layer Balun Transformer," which addresses the coupling of unbalanced and balanced devices. This invention involves an unbalanced balun structure that consists of components electrically coupled to a balanced balun structure. Its ability to receive unbalanced signals and output balanced signals permits effective communication between different electronic components, enriching the performance of electronic devices.

Career Highlights

Cheung's career includes pivotal roles at prominent companies such as DSP Group Limited and TLC Precision Wafer Technology, Inc. His experiences in these organizations have allowed him to hone his skills in electronic design and develop innovative solutions that push the boundaries of current technology.

Collaborations

Throughout his career, Cheung has worked alongside talented individuals in the field, including coworkers Ramesh Harjani and John J. Geddes. Their collaborative efforts have contributed to the successful development of cutting-edge technologies and have further cemented Cheung's reputation as a leading inventor in his domain.

Conclusion

Philip Cheung's accomplishments in patenting advanced integrated circuit designs highlight his significant impact on the electronics industry. With his innovative spirit and collaborative mindset, he continues to inspire future developments in technology. Through his patents, he provides valuable contributions that enhance the functionality and efficiency of electronic devices, illustrating the importance of innovation in today's digital age.