Dsp Group Limited

Tlc Precision Wafer Technology, Inc.

Bermai, Inc.

Philip Cheung

Ramesh Harjani

John J Geddes

Vladimir Sokolov

Stephanie M Carlson

In general, the invention is directed to integration of passive radio frequency (RF) structures with at least one integrated circuit in a single integrated circuit (IC) package. An IC package in accordance with the invention may include, for example, a radio IC, a digital IC, a passive radio frequency balun as well as additional passive RF structures or ICs. Additionally, passive electronic components may further be incorporated in the IC package. For example, the IC package may include a resistor, capacitor, inductor or the like. The components of the IC package may be distributed throughout layers of a multi-layer IC package, such as a multi-layer ceramic package. The different ICs and the passive RF structures may be electrically coupled via conductive traces, which may be varied in thickness and length in order to match input and output impedances of the different ICs and passive RF structures.

Circuit package integrating passive radio frequency structure

The invention provides a balun for coupling an unbalanced device with a balanced device. The balun may, for example, comprise an unbalanced balun structure having a first unbalanced component and a second unbalanced component electrically coupled to one another and a balanced balun structure having a first balanced component and a second balanced component. The first balanced component electromagnetically couples more than one side of the first unbalanced component and the second balanced component electromagnetically couples more than one side of the second unbalanced component. The unbalanced and balanced components may comprise conducting strips, such as strip lines, disposed on a dielectric layer. The balun may be formed on multiple layers or only a single layer. The balun receives unbalanced signals and outputs balanced signals, i.e., signals with a 180-degree phase shift and vice versa.

Multi-layer balun transformer

A multifunction high frequency integrated circuit structure and circuit configuration includes a resonator or oscillator circuit coupled to a buffer amplifier by way of a stripline coupler. The resonator circuit includes an input terminating region which is coupled to three input terminating ports. A first one of the input terminating ports is coupled directly to the resonator for either being electrically connected to a selected signal source or load, a second one of the input terminating ports is electrically connected to either a fixed or variable potential source, and the remaining input terminating port is coupled to the resonator input terminating region through another stripline coupler, and is intended to be electrically connected to another selected signal source. Depending upon the choice of circuit components and signal sources connected to the input terminating ports, the multifunction high frequency integrated circuit may serve as a voltage controlled oscillator, low phase noise oscillator, direct up/down frequency signal converter, or injection locked oscillator.

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Roseville, MN, United States of America

Philip Cheung