Company Filing History:
Years Active: 2006-2017
Title: The Innovations of Philip Beucler
Introduction
Philip Beucler is an accomplished inventor based in Danville, NH (US). He has made significant contributions to the field of radio frequency technology and chip packaging. With a total of 2 patents to his name, Beucler has demonstrated a commitment to innovation and engineering excellence.
Latest Patents
Beucler’s latest patents include a radio frequency connector and assembly having micro-via radial interconnect. This RF connector features a conductive pin designed to carry RF signals, with a first longitudinal end that interfaces with a male RF connector. The second longitudinal end connects to a printed circuit board (PCB) and may include a tapered design with a groove above the tapered end. The housing encircles the conductive pin and is shaped to accept the male RF connector, while a grounding element ensures proper contact with the PCB.
Another notable patent is the leadframe-based chip scale package (CSP). This innovation includes a leadframe with a die attach pad and multiple wire bonding pads. The design features at least one aperture in the die attach pad, a die on the pad, and bonding wires that connect the die to the wire bonding pads. The mold compound encapsulates the die and bonding wire, forming a robust chip package.
Career Highlights
Throughout his career, Beucler has worked with prominent companies such as M/A-COM, Inc. and Mercury Systems, Inc. His experience in these organizations has allowed him to refine his skills and contribute to various technological advancements.
Collaborations
Beucler has collaborated with notable professionals in the industry, including William James Palmteer and Daniel Coolidge. These partnerships have fostered innovation and the development of cutting-edge technologies.
Conclusion
Philip Beucler is a distinguished inventor whose work in radio frequency technology and chip packaging has made a lasting impact. His patents reflect a deep understanding of engineering principles and a dedication to advancing technology.