The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2006
Filed:
Sep. 28, 2001
Applicants:
William James Palmteer, North Andover, MA (US);
Philip Joseph Beucler, Danville, NH (US);
Inventors:
William James Palmteer, North Andover, MA (US);
Philip Joseph Beucler, Danville, NH (US);
Assignee:
M/A-COM, Inc., Lowell, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
An improved leadframe-based CSP and a method of forming the leadframe-based CSP are provided. The leadframe-based CSP includes a leadframe including a die attach pad and a plurality of wire bonding pads, at least one aperture disposed in the die attach pad, at least one die on the die attach pad, at least one bonding wire for electrically connecting the die and the wire bonding pads, and a mold compound for encapsulating the die and the bonding wire to form a chip package, wherein the mold compound is formed in the aperture.