Trumbull, CT, United States of America

Philip B Saba

This inventor holds 5 USPTO granted patents. Top assignee: Tie/communications, Inc.. Active years: 1983-1988.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Philip B Saba. Retrieved from https://idiyas.com/inventor/philip-b-saba

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 5

Forward Citations = 87(Granted Patents)


Company Filing History:


Years Active: 1983-1988

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5 patents (USPTO):Explore Patents

Title: The Innovations of Philip B. Saba

Introduction

Philip B. Saba is a notable inventor based in Trumbull, Connecticut. He has made significant contributions to the field of telecommunications, holding a total of five patents. His work has had a lasting impact on the industry, particularly in the development of telephone technology.

Latest Patents

Among his latest patents are innovations related to telephone sets and telephone station sets. These inventions showcase his commitment to enhancing communication technology and improving user experience.

Career Highlights

Philip B. Saba has built a successful career at Tie Communications, Inc. His role in the company has allowed him to focus on developing cutting-edge telecommunications solutions. His expertise and innovative mindset have positioned him as a key player in the industry.

Collaborations

Throughout his career, Philip has collaborated with various professionals, including his coworker Wilbert C. Brown. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of new technologies.

Conclusion

Philip B. Saba's contributions to telecommunications through his patents and career at Tie Communications, Inc. highlight his dedication to innovation. His work continues to influence the industry and inspire future inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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