Company Filing History:
Years Active: 2009
Title: Petros Negussu: Innovator in Multi-Chip Package Technology
Introduction
Petros Negussu is a notable inventor based in Morrisville, NC (US). He has made significant contributions to the field of integrated circuits, particularly in the design and functionality of multi-chip packages. His innovative approach has led to advancements that enhance chip performance and efficiency.
Latest Patents
Negussu holds a patent for "Differential chip performance within a multi-chip package." This invention involves a multi-chip package that includes at least a first die and a second die, each containing an integrated circuit (IC). The design features a plurality of contact pads that are coupled with their respective ICs. The first die's contact pads include a first mode pad linked to a first device, while the second die's pads feature a second mode pad connected to a second device. The operational modes of these devices are determined by the relative positioning of the dies, allowing for enhanced performance based on their configuration.
Career Highlights
Negussu is currently employed at Infineon Technologies AG, where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in pushing the boundaries of what is possible in multi-chip packaging.
Collaborations
Throughout his career, Negussu has collaborated with talented professionals, including James J Dietz and Thoai Thai Le. These partnerships have fostered a creative environment that encourages the exchange of ideas and technological advancements.
Conclusion
Petros Negussu's contributions to the field of integrated circuits and multi-chip packages exemplify the spirit of innovation. His patent and ongoing work at Infineon Technologies AG highlight his commitment to advancing technology in meaningful ways.