Infineon Technologies Ag

Petros Negussu

Thoai Thai Le

James J Dietz

A multi-chip package comprising at least a first die and a second die, wherein each die comprises an integrated circuit (IC) disposed thereon. Each of the first die and the second die comprise a plurality of contact pads coupled with the respective IC. The contact pads on the first IC comprise a first mode pad coupled to a first device formed on the first die, and the contact pads on the second IC comprise a second mode pad coupled to a second device formed on the second die. The first mode pad is coupled to a first potential and causes the first device to operate in a first mode. The second mode pad is coupled to a second potential and causes the second device to operate in a second mode. The first and second mode are selected based on the relative position of the first and second die.

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Morrisville, NC, United States of America

Petros Negussu